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CF-PV4010-R10 |
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Системы охлаждения для ЦП и чипов IEI customized cooler for LGA1150 Intel CPU,105*80.4*23.7,1U Chassis compatible,65W,CCL;RoHS |
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CM730-TM-AL |
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Системы охлаждения для ЦП и чипов CM 730 ALUMINIUM PASSIVE HEATSINK |
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CM730-TM-CU |
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Системы охлаждения для ЦП и чипов CM 730 COPPER PASSIVE HEATSINK |
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conga-B7AC/CSA-Cu-B |
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Системы охлаждения для ЦП и чипов Standard active cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP up to 17W * Cu = |
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conga-B7AC/CSA-Cu-T |
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Системы охлаждения для ЦП и чипов Standard active cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP up to 17W * Cu = |
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conga-B7AC/CSA-VC-B |
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Системы охлаждения для ЦП и чипов Standard active cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP |
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conga-B7AC/CSA-VC-T |
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Системы охлаждения для ЦП и чипов Standard active cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan.Intended for modules with TDP |
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conga-B7AC/CSP-Cu-B |
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Системы охлаждения для ЦП и чипов Standard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = copper plate * B = |
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conga-B7AC/CSP-Cu-T |
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Системы охлаждения для ЦП и чипов Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = co |
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conga-B7AC/CSP-VC-B |
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Системы охлаждения для ЦП и чипов Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP higher than 17W * |
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conga-B7AC/CSP-VC-T |
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Системы охлаждения для ЦП и чипов Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP higher than 17W * |
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conga-B7XD/CSA-HP-B |
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Системы охлаждения для ЦП и чипов Standard active cooling solution for high performance COM Express Type 7 module conga-TSXD with integrated heat pipes, 70mm radial 12V PWM fan and 30mm overall heat sink height. All standoffs are M2.5mm thread. |
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conga-B7XD/CSA-HP-T |
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Системы охлаждения для ЦП и чипов Standard active cooling solution for high performance COM Express Type 7 module conga-TSXD with integrated heat pipes, 70mm radial 12V PWM fan and 30mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
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conga-IA5/CSP |
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Системы охлаждения для ЦП и чипов Passive cooling solution for conga-IA5 based on open silicon Pentium and Celeron processors with 12mm heatsink fins. |
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conga-IA5/i-CSP |
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Системы охлаждения для ЦП и чипов Passive cooling solution for conga-IA5 based on lidded Atom E3900 processors with 12mm heatsink fins. |
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conga-PA5/CSP-T |
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Системы охлаждения для ЦП и чипов Passive cooling solution for conga-PA5 based on open silicon Pentium and Celeron processors and heat sink with 12mm heatsink fins. All standoffs are with 2.7 mm threaded hole. |
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conga-PA5/i-CSP-T |
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Системы охлаждения для ЦП и чипов Passive cooling solution for conga-PA5 based on lidded Atom E3900 processors with 12mm heatsink fins. All standoffs are with 2.7 mm threaded hole. |
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conga-QMX8/CSP-B |
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Системы охлаждения для ЦП и чипов Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex A72 processor. All standoffs are M2.5mm thread. |
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conga-QMX8/CSP-T |
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Системы охлаждения для ЦП и чипов Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex A72 processor. All standoffs are with 2.7mm bore hole. |
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conga-SMX8/i-CSP-B |
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Системы охлаждения для ЦП и чипов Pico-ITX chassis with passive cooling for conga-PA5 with non-lidded Intel Celeron and Pentium processors with IO shield, LED's, power button, 2x USB 2.0, 2.5" HDD mount, 2x antenna holes, 1x UART hole, VESA mounti |
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conga-TC170/CSA-B-2.5 |
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Системы охлаждения для ЦП и чипов Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded, 15mm fins, 18mm overall heat sink height and integrated 12V fan. |
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conga-TC170/CSA-B-2.7 |
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Системы охлаждения для ЦП и чипов Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole, 15mm fins, 18mm overall heat sink height and integrated 12V fan. |
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conga-TC170/CSP-B |
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Системы охлаждения для ЦП и чипов Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole. |
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conga-TC170/CSP-T |
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Системы охлаждения для ЦП и чипов Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded |
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